PowerPC G2 Microprocessor MPC82xx Series MPC8266 480-LBGA Exposed Pad
SOT-23
KMPC8266AVVPJDC Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Package / Case
480-LBGA Exposed Pad
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8266
Speed
300MHz
Core Processor
PowerPC G2
Voltage - I/O
3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
ROHS3 Compliant
KMPC8266AVVPJDC Product Details
KMPC8266AVVPJDC Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 480-LBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC82xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM, SDRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, SCC, SMC, SPI, UART, USART for better service. At 3.3V, the CPU runs its I/O. Search MPC8266 for variants of the embedded microprocessor.
KMPC8266AVVPJDC Features
PowerPC G2 Core
KMPC8266AVVPJDC Applications
There are a lot of NXP USA Inc. KMPC8266AVVPJDC Microprocessor applications.