PowerPC G2_LE Microprocessor MPC82xx Series MPC8270 516-BBGA
SOT-23
KMPC8270CVRMIBA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
516-BBGA
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8270
Speed
266MHz
Core Processor
PowerPC G2_LE
Voltage - I/O
3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
ROHS3 Compliant
KMPC8270CVRMIBA Product Details
KMPC8270CVRMIBA Overview
Due to its 516-BBGA packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the MPC82xx series. PowerPC G2_LE is the processor core of this CPU. Memory controllers for this CPU are DRAM, SDRAM. Featuring I2C, SCC, SMC, SPI, UART, USART interfaces, this microprocessor can better serve you. There is 3.3V I/O running on this CPU. MPC8270 is a good way to search for variants of the microprocessor.
KMPC8270CVRMIBA Features
PowerPC G2_LE Core
KMPC8270CVRMIBA Applications
There are a lot of NXP USA Inc. KMPC8270CVRMIBA Microprocessor applications.