PowerPC G2_LE Microprocessor MPC82xx Series MPC8270 480-LBGA Exposed Pad
SOT-23
KMPC8270CVVQLDA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
480-LBGA Exposed Pad
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
2A (4 Weeks)
Base Part Number
MPC8270
Speed
333MHz
Core Processor
PowerPC G2_LE
Voltage - I/O
3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
ROHS3 Compliant
KMPC8270CVVQLDA Product Details
KMPC8270CVVQLDA Overview
With a packing size of 480-LBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TA. A MPC82xx series item. A PowerPC G2_LE processor is present in this CPU. The CPU contains DRAM, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, SCC, SMC, SPI, UART, USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with MPC8270.
KMPC8270CVVQLDA Features
PowerPC G2_LE Core
KMPC8270CVVQLDA Applications
There are a lot of NXP USA Inc. KMPC8270CVVQLDA Microprocessor applications.