PowerPC G2_LE Microprocessor MPC82xx Series MPC8270 516-BBGA
SOT-23
KMPC8270CZQMIBA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
516-BBGA
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8270
Speed
266MHz
Core Processor
PowerPC G2_LE
Voltage - I/O
3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
Non-RoHS Compliant
KMPC8270CZQMIBA Product Details
KMPC8270CZQMIBA Overview
The embedded microprocessor has been packed in 516-BBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~105°C TA is determined. This is a member of the MPC82xx series. With a core count of PowerPC G2_LE, this CPU is multicore. A CPU with this architecture uses DRAM, SDRAM RAM controllers. With its I2C, SCC, SMC, SPI, UART, USART interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use MPC8270 when searching for variants of the embedded microprocessor.
KMPC8270CZQMIBA Features
PowerPC G2_LE Core
KMPC8270CZQMIBA Applications
There are a lot of NXP USA Inc. KMPC8270CZQMIBA Microprocessor applications.