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KMPC8270CZQMIBA

KMPC8270CZQMIBA

KMPC8270CZQMIBA

NXP USA Inc.

PowerPC G2_LE Microprocessor MPC82xx Series MPC8270 516-BBGA

SOT-23

KMPC8270CZQMIBA Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 516-BBGA
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC82xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC8270
Speed 266MHz
Core Processor PowerPC G2_LE
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
USB USB 2.0 (1)
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
RoHS Status Non-RoHS Compliant
KMPC8270CZQMIBA Product Details

KMPC8270CZQMIBA Overview


The embedded microprocessor has been packed in 516-BBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -40°C~105°C TA is determined. This is a member of the MPC82xx series. With a core count of PowerPC G2_LE, this CPU is multicore. A CPU with this architecture uses DRAM, SDRAM RAM controllers. With its I2C, SCC, SMC, SPI, UART, USART interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use MPC8270 when searching for variants of the embedded microprocessor.

KMPC8270CZQMIBA Features


PowerPC G2_LE Core


KMPC8270CZQMIBA Applications


There are a lot of NXP USA Inc.
KMPC8270CZQMIBA Microprocessor applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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