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KMPC8270ZQMIBA

KMPC8270ZQMIBA

KMPC8270ZQMIBA

NXP USA Inc.

PowerPC G2_LE Microprocessor MPC82xx Series MPC8270 516-BBGA

SOT-23

KMPC8270ZQMIBA Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 516-BBGA
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC82xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC8270
Speed 266MHz
Core Processor PowerPC G2_LE
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
USB USB 2.0 (1)
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
RoHS Status Non-RoHS Compliant
KMPC8270ZQMIBA Product Details

KMPC8270ZQMIBA Overview


Packed in 516-BBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~105°C TA. It comes from the MPC82xx series. This CPU is cored with a PowerPC G2_LE processor. This CPU uses DRAM, SDRAM RAM controllers. To serve better this microprocessor features I2C, SCC, SMC, SPI, UART, USART interfaces. This CPU runs I/O at 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC8270.

KMPC8270ZQMIBA Features


PowerPC G2_LE Core


KMPC8270ZQMIBA Applications


There are a lot of NXP USA Inc.
KMPC8270ZQMIBA Microprocessor applications.


  • Measurement and control field
  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan

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