PowerPC e300c2 Microprocessor MPC83xx Series MPC8323 516-BBGA
SOT-23
KMPC8323ECZQADDC Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
516-BBGA
Supplier Device Package
516-FPBGA (27x27)
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
MPC83xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8323
Speed
266MHz
Core Processor
PowerPC e300c2
Voltage - I/O
1.8V 2.5V 3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, DDR2
USB
USB 2.0 (1)
Additional Interfaces
DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP
Communications; QUICC Engine, Security; SEC 2.2
Security Features
Cryptography
RoHS Status
ROHS3 Compliant
KMPC8323ECZQADDC Product Details
KMPC8323ECZQADDC Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 516-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~105°C TA. The cpu microprocessor belongs to the MPC83xx series. The CPU is cored with a PowerPC e300c2 processor. The CPU uses DDR, DDR2 RAM controllers. This microprocessor features interfaces DUART, I2C, PCI, SPI, TDM, UART. In this CPU, I/O is set to 1.8V 2.5V 3.3V. The microprocessor can be searched for with MPC8323 if you are looking for variants. Suppliers offer a package of 516-FPBGA (27x27).
KMPC8323ECZQADDC Features
PowerPC e300c2 Core
KMPC8323ECZQADDC Applications
There are a lot of NXP USA Inc. KMPC8323ECZQADDC Microprocessor applications.