KMPC8555EPXALF Overview

Shipping overseas is convenient since the embedded microprocessor is packed in 783-BBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC85xx series. The CPU is cored with a PowerPC e500 processor. The CPU uses DDR, SDRAM RAM controllers. This microprocessor features interfaces DUART, I2C, PCI, SPI, TDM, UART. In this CPU, I/O is set to 2.5V 3.3V. The microprocessor can be searched for with MPC8555 if you are looking for variants. Suppliers offer a package of 783-FCPBGA (29x29).

KMPC8555EPXALF Features

PowerPC e500 Core

KMPC8555EPXALF Applications

There are a lot of NXP USA Inc.
KMPC8555EPXALF Microprocessor applications.

• Consumer electronics products
• Toys
• Robots
• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers