PowerPC e500 Microprocessor MPC85xx Series MPC8555 783-BBGA, FCBGA
SOT-23
KMPC8555EVTALF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
783-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8555
Speed
667MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM, Security; SEC
Security Features
Cryptography, Random Number Generator
RoHS Status
ROHS3 Compliant
KMPC8555EVTALF Product Details
KMPC8555EVTALF Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 783-BBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC85xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR, SDRAM RAM controllers are used by this CPU. The microprocessor features interfaces DUART, I2C, PCI, SPI, TDM, UART for better service. At 2.5V 3.3V, the CPU runs its I/O. Search MPC8555 for variants of the embedded microprocessor. It is offered by suppliers as a package 783-FCPBGA (29x29).
KMPC8555EVTALF Features
PowerPC e500 Core
KMPC8555EVTALF Applications
There are a lot of NXP USA Inc. KMPC8555EVTALF Microprocessor applications.