PowerPC e500 Microprocessor MPC85xx Series MPC8555 783-BBGA, FCBGA
SOT-23
KMPC8555PXAPF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
783-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8555
Speed
833MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
KMPC8555PXAPF Product Details
KMPC8555PXAPF Overview
The microprocessor is conveniently packaged in 783-BBGA, FCBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around 0°C~105°C TA. The MPC85xx series contains it. A PowerPC e500 processor powers this CPU. DDR, SDRAM RAM controllers are used by this CPU. This microprocessor has DUART, I2C, PCI, SPI, TDM, UART interfaces to serve you better. I/O is run at 2.5V 3.3V on this CPU. Try searching for variants of the cpu microprocessor with MPC8555. Suppliers offer a 783-FCPBGA (29x29) package.
KMPC8555PXAPF Features
PowerPC e500 Core
KMPC8555PXAPF Applications
There are a lot of NXP USA Inc. KMPC8555PXAPF Microprocessor applications.