MPC8xx Microprocessor MPC8xx Series MPC859 357-BBGA
SOT-23
KMPC859DSLCVR66A Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
-40°C~100°C TA
Packaging
Tray
Series
MPC8xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC859
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
KMPC859DSLCVR66A Product Details
KMPC859DSLCVR66A Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~100°C TA. A MPC8xx series item. A MPC8xx processor is present in this CPU. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with MPC859. A supplier offers a 357-PBGA (25x25) package.
KMPC859DSLCVR66A Features
MPC8xx Core
KMPC859DSLCVR66A Applications
There are a lot of NXP USA Inc. KMPC859DSLCVR66A Microprocessor applications.