Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~100°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MPC859 for variants of the embedded microprocessor.
KMPC859DSLCZP66A Features
KMPC859DSLCZP66A Applications
There are a lot of NXP USA Inc. KMPC859DSLCZP66A Microprocessor applications.