MPC8xx Microprocessor MPC8xx Series MPC859 357-BBGA
SOT-23
KMPC859DSLVR66A Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~95°C TA
Packaging
Tray
Series
MPC8xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC859
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
KMPC859DSLVR66A Product Details
KMPC859DSLVR66A Overview
Since the microprocessor is packed in 357-BBGA, shipping overseas is convenient. High reliability is achieved by using advanced packaging methods Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. K0°C~95°C TAw what the operating temperature is around 0°C~95°C TA. In the series MPC8xx, it is found. MPC8xx processors are embedded in this CPU. There are DRAM RAM controllers used by this CPU. Microprocessors with I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces are designed to serve users better. 3.3V is the I/O speed of this CPU. Use MPC859 to search for variants of the cpu microprocessor. Suppliers offer the 357-PBGA (25x25) package.
KMPC859DSLVR66A Features
MPC8xx Core
KMPC859DSLVR66A Applications
There are a lot of NXP USA Inc. KMPC859DSLVR66A Microprocessor applications.