MPC8xx Microprocessor MPC8xx Series MPC859 357-BBGA
SOT-23
KMPC859DSLZP66A Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~95°C TA
Packaging
Tray
Series
MPC8xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC859
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
KMPC859DSLZP66A Product Details
KMPC859DSLZP66A Overview
The embedded microprocessor ships overseas conveniently packed in 357-BBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around 0°C~95°C TA. MPC8xx is its series number. Core-wise, this CPU has a MPC8xx processor. It has DRAM RAM controllers. A I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 3.3V. To find variants of the microprocessor, try searching with MPC859. There is a 357-PBGA (25x25) package offered by suppliers.
KMPC859DSLZP66A Features
MPC8xx Core
KMPC859DSLZP66A Applications
There are a lot of NXP USA Inc. KMPC859DSLZP66A Microprocessor applications.