Packed in 357-BBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around -40°C~95°C TA. It comes from the MPC8xx series. This CPU uses DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces. This CPU runs I/O at 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC860.
KMPC860SRCVR66D4 Features
KMPC860SRCVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860SRCVR66D4 Microprocessor applications.