MPC8xx Microprocessor MPC8xx Series MPC870 256-BBGA
SOT-23
KMPC870ZT133 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
256-BBGA
Supplier Device Package
256-PBGA (23x23)
Operating Temperature
0°C~95°C TA
Packaging
Tray
Series
MPC8xx
Published
2003
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC870
Speed
133MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, PCMCIA, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
KMPC870ZT133 Product Details
KMPC870ZT133 Overview
Packed in 256-BBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~95°C TA. It comes from the MPC8xx series. This CPU is cored with a MPC8xx processor. This CPU uses DRAM RAM controllers. To serve better this microprocessor features I2C, PCMCIA, SPI, TDM, UART interfaces. This CPU runs I/O at 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC870. 256-PBGA (23x23) package is offered by suppliers.
KMPC870ZT133 Features
MPC8xx Core
KMPC870ZT133 Applications
There are a lot of NXP USA Inc. KMPC870ZT133 Microprocessor applications.