The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~95°C TA should be understood. This is part of the MPC8xx series. The CPU is powered by a MPC8xx core. There are DRAM RAM controllers on this CPU. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. The CPU runs I/O at 3.3V. Using MPC875 will help you find variants of the cpu microprocessor. Suppliers offer 256-PBGA (23x23) packages.
KMPC875VR66 Features
MPC8xx Core
KMPC875VR66 Applications
There are a lot of NXP USA Inc. KMPC875VR66 Microprocessor applications.