Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MPC885 for variants of the embedded microprocessor. It is offered by suppliers as a package 357-PBGA (25x25).
KMPC885VR66 Features
MPC8xx Core
KMPC885VR66 Applications
There are a lot of NXP USA Inc. KMPC885VR66 Microprocessor applications.