PowerPC G2 Microprocessor MPC82xx Series PC8255 480-LBGA Exposed Pad
SOT-23
KXPC8255VVIFBC Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
480-LBGA Exposed Pad
Supplier Device Package
480-TBGA (37.5x37.5)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
PC8255
Speed
200MHz
Core Processor
PowerPC G2
Voltage - I/O
3.3V
Ethernet
10/100Mbps (3)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
ROHS3 Compliant
KXPC8255VVIFBC Product Details
KXPC8255VVIFBC Overview
With a packing size of 480-LBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~105°C TA. A MPC82xx series item. A PowerPC G2 processor is present in this CPU. The CPU contains DRAM, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, SCC, SMC, SPI, UART, USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PC8255. A supplier offers a 480-TBGA (37.5x37.5) package.
KXPC8255VVIFBC Features
PowerPC G2 Core
KXPC8255VVIFBC Applications
There are a lot of NXP USA Inc. KXPC8255VVIFBC Microprocessor applications.