64KB 64K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller LPC11E3x Series 32-VFQFN Exposed Pad
SOT-23
LPC11E35FHI33/501E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
LPC11E3x
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Number of I/O
26
Speed
50MHz
RAM Size
12K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
Core Processor
ARM® Cortex®-M0
Peripherals
Brown-out Detect/Reset, POR, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
64KB 64K x 8
Connectivity
I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Data Converter
A/D 8x10b
EEPROM Size
4K x 8
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
490
$3.05065
$1494.8185
LPC11E35FHI33/501E Product Details
LPC11E35FHI33/501E Overview
The package is in 32-VFQFN Exposed Pad format. The MCU has 26 I/O ports. There is a mounting type Surface Mount associated with this Microcontroller. This Microcontroller is based on the 32-Bit core. There is a memory type of FLASH in its program memory. The temperature range that this Microcontroller operates at is -40°C~85°C TA. The electrical component that you are looking at belongs to the LPC11E3x series of components. Microcontroller has abundant program memory size of 64KB 64K x 8. The ARM® Cortex®-M0 Core Processor powers the device and is one of its key features.
LPC11E35FHI33/501E Features
32-VFQFN Exposed Pad package Mounting type of Surface Mount
LPC11E35FHI33/501E Applications
There are a lot of NXP USA Inc. LPC11E35FHI33/501E Microcontroller applications.