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LPC11E35FHI33/501E

LPC11E35FHI33/501E

LPC11E35FHI33/501E

NXP USA Inc.

64KB 64K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller LPC11E3x Series 32-VFQFN Exposed Pad

SOT-23

LPC11E35FHI33/501E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Operating Temperature -40°C~85°C TA
Packaging Tray
Series LPC11E3x
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Number of I/O 26
Speed 50MHz
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
Core Processor ARM® Cortex®-M0
Peripherals Brown-out Detect/Reset, POR, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Data Converter A/D 8x10b
EEPROM Size 4K x 8
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
490 $3.05065 $1494.8185
LPC11E35FHI33/501E Product Details

LPC11E35FHI33/501E Overview


The package is in 32-VFQFN Exposed Pad format. The MCU has 26 I/O ports. There is a mounting type Surface Mount associated with this Microcontroller. This Microcontroller is based on the 32-Bit core. There is a memory type of FLASH in its program memory. The temperature range that this Microcontroller operates at is -40°C~85°C TA. The electrical component that you are looking at belongs to the LPC11E3x series of components. Microcontroller has abundant program memory size of 64KB 64K x 8. The ARM® Cortex®-M0 Core Processor powers the device and is one of its key features.

LPC11E35FHI33/501E Features


32-VFQFN Exposed Pad package
Mounting type of Surface Mount


LPC11E35FHI33/501E Applications


There are a lot of NXP USA Inc.
LPC11E35FHI33/501E Microcontroller applications.


  • Kindle
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  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
  • DVDDVMP3 players

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