LPC18S10FET180E

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Manufacturer part number:LPC18S10FET180E

Manufacturer:NXP USA Inc.

Description:ROMless ARM® Cortex®-M3 32-Bit Microcontroller LPC18xx Series 180-TFBGA

Case Package:SOT-23

Datasheet:LPC18S10FET180E Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	180-TFBGA
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	LPC18xx
Published	2014
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Oscillator Type	Internal
Number of I/O	49
Speed	180MHz
RAM Size	136K x 8
Voltage - Supply (Vcc/Vdd)	2.2V~3.6V
Core Processor	ARM® Cortex®-M3
Peripherals	Brown-out Detect/Reset, DMA, I2S, POR, WDT
Program Memory Type	ROMless
Core Size	32-Bit
Connectivity	CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Data Converter	A/D 4x10b; D/A 1x10b
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
189	$6.44894	$1218.84966

LPC18S10FET180E Overview

In a 180-TFBGA package, the MCU is available. 49 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 32-Bit core is the core of the MCU. There is a ROMless type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. LPC18xx series components make up this electrical component. A ARM® Cortex®-M3 Core processor is used to power the device.