LPC18S37JET100E Overview

The package is 100-TFBGA-shaped. There are 49 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~105°C TA are operated by this Microcontroller. It is part of the LPC18xx series of electrical components. Having a size of 1MB 1M x 8, Microcontroller has a program memory of X bytes. A ARM® Cortex®-M3 Core Processor is at the core of this Microcontroller.

LPC18S37JET100E Features

100-TFBGA package
Mounting type of Surface Mount

LPC18S37JET100E Applications

There are a lot of NXP USA Inc.
LPC18S37JET100E Microcontroller applications.

• Instrument control
• Toys
• Robots
• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers