256KB 256K x 8 FLASH ARM® Cortex®-M33 32-Bit Microcontroller LPC55S2x Series 64-TQFP Exposed Pad
SOT-23
LPC55S26JBD64K Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Operating Temperature
-40°C~105°C TA
Series
LPC55S2x
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Number of I/O
36
Speed
150MHz
RAM Size
144K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
Core Processor
ARM® Cortex®-M33
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
256KB 256K x 8
Connectivity
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Data Converter
A/D 10x16b
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$8.41000
$8.41
500
$8.3259
$4162.95
1000
$8.2418
$8241.8
1500
$8.1577
$12236.55
2000
$8.0736
$16147.2
2500
$7.9895
$19973.75
LPC55S26JBD64K Product Details
LPC55S26JBD64K Overview
The package has a 64-TQFP Exposed Pad shape. With 36 I/Os, it's pretty good. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit core. As far as its program memory type is concerned, it is FLASH. Temperatures within -40°C~105°C TA range are measured by this Microcontroller. The LPC55S2x series is comprised of this electrical component. The electronic part has a program memory size of 256KB 256K x 8. There's a ARM® Cortex®-M33 Core Processor inside.
LPC55S26JBD64K Features
64-TQFP Exposed Pad package Mounting type of Surface Mount
LPC55S26JBD64K Applications
There are a lot of NXP USA Inc. LPC55S26JBD64K Microcontroller applications.