LPC55S28JBD64K

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Manufacturer part number:LPC55S28JBD64K

Manufacturer:NXP USA Inc.

Description:512KB 512K x 8 FLASH ARM® Cortex®-M33 32-Bit Microcontroller LPC55S2x Series 64-TQFP Exposed Pad

Case Package:SOT-23

Datasheet:LPC55S28JBD64K Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	16 Weeks
Mounting Type	Surface Mount
Package / Case	64-TQFP Exposed Pad
Operating Temperature	-40°C~105°C TA
Series	LPC55S2x
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Oscillator Type	Internal
Number of I/O	36
Speed	150MHz
RAM Size	256K x 8
Voltage - Supply (Vcc/Vdd)	1.8V~3.6V
Core Processor	ARM® Cortex®-M33
Peripherals	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Program Memory Type	FLASH
Core Size	32-Bit
Program Memory Size	512KB 512K x 8
Connectivity	Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Data Converter	A/D 10x16b
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$9.49000	$9.49
500	$9.3951	$4697.55
1000	$9.3002	$9300.2
1500	$9.2053	$13807.95
2000	$9.1104	$18220.8
2500	$9.0155	$22538.75

LPC55S28JBD64K Overview

This Microcontroller comes in a 64-TQFP Exposed Pad package. This Microcontroller has 36 I/Os. The Mounting Type of the Microcontroller is Surface Mount. The MCU is based on the 32-Bit core. This Microcontroller's program memory type is FLASH. The Microcontroller runs in -40°C~105°C TA Operating Temperature. Microcontroller runs in LPC55S2x Series. The size of the program memory of Microcontroller is 512KB 512K x 8. MCU is powered by ARM® Cortex®-M33 Core Processor.