ARM® Cortex®-A7 Microprocessor QorIQ® Layerscape Series 525-FBGA, FCBGA
SOT-23
LS1022ASE7EKB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
525-FBGA, FCBGA
Operating Temperature
0°C~105°C
Packaging
Tray
Series
QorIQ® Layerscape
Published
2002
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
600MHz
Core Processor
ARM® Cortex®-A7
Ethernet
GbE (2)
Number of Cores/Bus Width
2 Core 32-Bit
RAM Controllers
DDR3L, DDR4
USB
USB 2.0 (1)
Co-Processors/DSP
Multimedia; NEON™ SIMD
Security Features
Secure Boot, TrustZone®
SATA
SATA 3Gbps (1)
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
84
$29.17202
$2450.44968
LS1022ASE7EKB Product Details
LS1022ASE7EKB Overview
Since the microprocessor is packed in 525-FBGA, FCBGA, shipping overseas is convenient. High reliability is achieved by using advanced packaging methods Tray. This CPU has 2 Core 32-Bit cores and 2 Core 32-Bit bus widths. K0°C~105°Cw what the operating temperature is around 0°C~105°C. In the series QorIQ® Layerscape, it is found. ARM® Cortex®-A7 processors are embedded in this CPU. There are DDR3L, DDR4 RAM controllers used by this CPU.
LS1022ASE7EKB Features
ARM® Cortex®-A7 Core
LS1022ASE7EKB Applications
There are a lot of NXP USA Inc. LS1022ASE7EKB Microprocessor applications.