ARM® Cortex®-A7 Microprocessor QorIQ® Layerscape Series 525-FBGA, FCBGA
SOT-23
LS1022AXN7EKB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
525-FBGA, FCBGA
Operating Temperature
-40°C~105°C
Packaging
Tray
Series
QorIQ® Layerscape
Published
2002
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
600MHz
Core Processor
ARM® Cortex®-A7
Ethernet
GbE (2)
Number of Cores/Bus Width
2 Core 32-Bit
RAM Controllers
DDR3L, DDR4
USB
USB 2.0 (1)
Co-Processors/DSP
Multimedia; NEON™ SIMD
Security Features
Secure Boot, TrustZone®
SATA
SATA 3Gbps (1)
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$35.38000
$35.38
10
$32.62700
$326.27
84
$31.16095
$2617.5198
168
$27.86161
$4680.75048
LS1022AXN7EKB Product Details
LS1022AXN7EKB Overview
Packed in 525-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around -40°C~105°C. It comes from the QorIQ® Layerscape series. This CPU is cored with a ARM® Cortex®-A7 processor. This CPU uses DDR3L, DDR4 RAM controllers.
LS1022AXN7EKB Features
ARM® Cortex®-A7 Core
LS1022AXN7EKB Applications
There are a lot of NXP USA Inc. LS1022AXN7EKB Microprocessor applications.