LS1023ASE8MNLB Overview

Shipping overseas is convenient since the embedded microprocessor is packed in 780-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 64-Bit. Recognize operating temperatures around 0°C~105°C. The cpu microprocessor belongs to the QorIQ® Layerscape series. The CPU is cored with a ARM® Cortex®-A53 processor. The CPU uses DDR3L, DDR4 RAM controllers.

LS1023ASE8MNLB Features

ARM® Cortex®-A53 Core

LS1023ASE8MNLB Applications

There are a lot of NXP USA Inc.
LS1023ASE8MNLB Microprocessor applications.

• Consumer electronics products
• Toys
• Robots
• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers