ARM® Cortex®-A72 Microprocessor QorIQ® Layerscape Series 780-FBGA, FCBGA
SOT-23
LS1026AXN8Q1A Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
780-FBGA, FCBGA
Operating Temperature
-40°C~105°C
Packaging
Tray
Series
QorIQ® Layerscape
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
1.6GHz
Core Processor
ARM® Cortex®-A72
Ethernet
10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width
2 Core 64-Bit
RAM Controllers
DDR4
USB
USB 3.0 (3) + PHY
Security Features
Secure Boot, TrustZone®
SATA
SATA 6Gbps (1)
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$90.53333
$5431.9998
LS1026AXN8Q1A Product Details
LS1026AXN8Q1A Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 780-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 64-Bit. Recognize operating temperatures around -40°C~105°C. The cpu microprocessor belongs to the QorIQ® Layerscape series. The CPU is cored with a ARM® Cortex®-A72 processor. The CPU uses DDR4 RAM controllers.
LS1026AXN8Q1A Features
ARM® Cortex®-A72 Core
LS1026AXN8Q1A Applications
There are a lot of NXP USA Inc. LS1026AXN8Q1A Microprocessor applications.