0.8mm ARM® Cortex®-A72 Microprocessor QorIQ® Layerscape Series 780-FBGA, FCBGA
SOT-23
LS1046ASE8Q1A Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
780-FBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~105°C
Packaging
Tray
Series
QorIQ® Layerscape
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
780
ECCN Code
5A002.A.1
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B780
Speed
1.6GHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Core Processor
ARM® Cortex®-A72
Ethernet
10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width
4 Core 64-Bit
RAM Controllers
DDR4
USB
USB 3.0 (3) + PHY
Security Features
Secure Boot, TrustZone®
SATA
SATA 6Gbps (1)
Length
23mm
Height Seated (Max)
2.07mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$91.84883
$5510.9298
LS1046ASE8Q1A Product Details
LS1046ASE8Q1A Overview
The embedded microprocessor has been packed in 780-FBGA, FCBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 4 Core 64-Bit cores and width 4 Core 64-Bit busses is used. Understand how the operating temperature around 0°C~105°C is determined. This is a member of the QorIQ® Layerscape series. With a core count of ARM® Cortex®-A72, this CPU is multicore. A CPU with this architecture uses DDR4 RAM controllers. uPs/uCs/Peripheral ICs type is MICROPROCESSOR, RISC. Overall, there are 780 terminations.
LS1046ASE8Q1A Features
ARM® Cortex®-A72 Core
LS1046ASE8Q1A Applications
There are a lot of NXP USA Inc. LS1046ASE8Q1A Microprocessor applications.