Packed in 672-BGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~70°C TA. This CPU is cored with a ARM® Cortex®-A9 processor. This CPU uses DDR3 RAM controllers. To serve better this microprocessor features I2C, I2S, SPI, UART interfaces.
M82172G23 Features
ARM® Cortex®-A9 Core
M82172G23 Applications
There are a lot of NXP USA Inc. M82172G23 Microprocessor applications.