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M82172G23

M82172G23

M82172G23

NXP USA Inc.

ARM® Cortex®-A9 Microprocessor 672-BGA

SOT-23

M82172G23 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 672-BGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2014
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 1.2GHz
Core Processor ARM® Cortex®-A9
Ethernet GbE (3)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3
USB USB 2.0 + PHY (1), USB 3.0 + PHY
Additional Interfaces I2C, I2S, SPI, UART
Security Features Secure Boot, TrustZone®
SATA SATA 3Gbps (2)
RoHS Status ROHS3 Compliant
M82172G23 Product Details

M82172G23 Overview


Packed in 672-BGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 2 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~70°C TA. This CPU is cored with a ARM® Cortex®-A9 processor. This CPU uses DDR3 RAM controllers. To serve better this microprocessor features I2C, I2S, SPI, UART interfaces.

M82172G23 Features


ARM® Cortex®-A9 Core


M82172G23 Applications


There are a lot of NXP USA Inc.
M82172G23 Microprocessor applications.


  • Measurement and control field
  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan

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