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MC33FS4500NAE

MC33FS4500NAE

MC33FS4500NAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS4500NAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
250 $5.03100 $1257.75
MC33FS4500NAE Product Details

MC33FS4500NAE Overview


The way of Tray is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.It works with 1V~5V voltage.

MC33FS4500NAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4500NAE Applications


There are a lot of NXP USA Inc. MC33FS4500NAEPower Management applications.

  • Chromebook
  • FPGA, DSP Core Power
  • Industrial Telemetry Applications
  • Isolated DC-DC Modules
  • LP2996A: DDR3
  • Set-Top-Box
  • Networking Equipment
  • Radar
  • System Thermal for Servers
  • I/Os (FPGAs, ASICs, DSPs)

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