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MC33FS4502LAE

MC33FS4502LAE

MC33FS4502LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS4502LAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $9.13000 $9.13
10 $8.32900 $83.29
25 $7.98120 $199.53
250 $6.76652 $1691.63
500 $6.24600 $3123
1,000 $5.55200 $5.552
MC33FS4502LAE Product Details

MC33FS4502LAE Overview


Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at 1V~5V volts.

MC33FS4502LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4502LAE Applications


There are a lot of NXP USA Inc. MC33FS4502LAEPower Management applications.

  • In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
  • Desktop PC
  • SSTL-18 Termination
  • Applications Processors
  • Power Factor Correction
  • LP2996-N: DDR1 Termination Voltage
  • Power Supplies
  • Automotive display
  • DDR-II Termination Voltage
  • Wireless routers

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