MC33FS4502LAER2 Overview

Shipments can be made in the direction of Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.For easy adaptation, Surface Mount is a universal mounting method.The power management is designed for use with applications at System Basis Chip .The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management runs on 1V~5V voltage.

MC33FS4502LAER2 Features

Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4502LAER2 Applications

There are a lot of NXP USA Inc. MC33FS4502LAER2Power Management applications.

• DSP
• Automotive camera module
• Automotive head unit
• Tablets
• Cluster
• Memory Power
• Automotive Infotainment
• HSTL Termination
• FPGA, DSP Core Power
• 4K Ultra High Definition (UHD) Display