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MC33FS4503NAE

MC33FS4503NAE

MC33FS4503NAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS4503NAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
250 $6.76652 $1691.63
MC33FS4503NAE Product Details

MC33FS4503NAE Overview


Tray is an acceptable method of shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method allows for easy adaptation.This power management targets at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.

MC33FS4503NAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4503NAE Applications


There are a lot of NXP USA Inc. MC33FS4503NAEPower Management applications.

  • System Health Prognostics
  • Portable Navigation Devices
  • Industrial Equipment
  • Digital Signage
  • Industrial Telemetry Applications
  • Switches
  • Server Backplane Systems
  • SmartPhones
  • WOA
  • LP2996A: DDR1

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