The way of Tray is acceptable for shipping the power management.The package is conveniently packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.The power management is designed for use with applications at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management works at 1V~5V voltage.
MC33FS6500LAE Features
Mainly used in System Basis Chip applications Operating temperature: -40°C~125°C
MC33FS6500LAE Applications
There are a lot of NXP USA Inc. MC33FS6500LAEPower Management applications.