MC33FS6501CAER2 Overview

It is acceptable to ship using the method Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.For its operation, this power management requires 1V~5V voltage.

MC33FS6501CAER2 Features

Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6501CAER2 Applications

There are a lot of NXP USA Inc. MC33FS6501CAER2Power Management applications.

• Modules With Remote-Sense Capability
• Chromebook
• Port/cable dongles
• Debug
• System Thermal for PCs
• LP2996A: DDR2
• Standard notebook PC
• Real-time Signal Monitoring
• Netbooks
• Storage Systems