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MC33FS6502LAE

MC33FS6502LAE

MC33FS6502LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6502LAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8.43000 $8.43
10 $7.61100 $76.11
25 $7.25720 $181.43
250 $6.01800 $1504.5
500 $5.48700 $2743.5
1,000 $4.77900 $4.779
MC33FS6502LAE Product Details

MC33FS6502LAE Overview


It is acceptable to ship in the direction of Tray .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.Surface Mount is a universal mounting method for easy adaptation.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.

MC33FS6502LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6502LAE Applications


There are a lot of NXP USA Inc. MC33FS6502LAEPower Management applications.

  • Wireless routers
  • Storage Systems
  • SSTL-18 Termination
  • LP2996A: DDR3
  • Termination Voltage
  • Desktop PC
  • DDR-II Termination Voltage
  • Power Supplies
  • Chromebook
  • Medical

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