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MC33FS6503CAE

MC33FS6503CAE

MC33FS6503CAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6503CAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $10.089000 $10.089
10 $9.517925 $95.17925
100 $8.979174 $897.9174
500 $8.470919 $4235.4595
1000 $7.991433 $7991.433
MC33FS6503CAE Product Details

MC33FS6503CAE Overview


It is acceptable to ship in the way of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.At System Basis Chip and other applications, this power management is targeted.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .As a result, this power management is powered by 1V~5V voltage.

MC33FS6503CAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6503CAE Applications


There are a lot of NXP USA Inc. MC33FS6503CAEPower Management applications.

  • Real-time Signal Monitoring
  • Set-Top-Box
  • FPGA
  • Telecom Rectifiers
  • SmartPhones
  • Applications Processors
  • System Thermal for PCs
  • FPGA, DSP Core Power
  • Laser TV
  • Cordless Phone Base Station

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