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MC33FS6503CAER2

MC33FS6503CAER2

MC33FS6503CAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6503CAER2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,000 $6.08300 $12.166
MC33FS6503CAER2 Product Details

MC33FS6503CAER2 Overview


Tape & Reel (TR) is an acceptable method of shipping the power management.Packing in 48-LQFP Exposed Pad makes transportation convenient.Surface Mount is a universal mounting method for easy adaptation.There are a number of applications targeted at System Basis Chip .Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.

MC33FS6503CAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6503CAER2 Applications


There are a lot of NXP USA Inc. MC33FS6503CAER2Power Management applications.

  • Digital Cores
  • Electronic Test Instrumentation
  • Networking Equipment
  • Port/cable adapters
  • Portable Systems
  • Set-Top-Box
  • Telecommunication
  • Industrial Equipment
  • Debug
  • LTE modem

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