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MC33FS6504LAER2

MC33FS6504LAER2

MC33FS6504LAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6504LAER2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,000 $6.20940 $12.4188
MC33FS6504LAER2 Product Details

MC33FS6504LAER2 Overview


Using Tape & Reel (TR) as a shipping the power management path is acceptable.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.Applications targeting this power management include System Basis Chip and others.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.The power management runs on 1V~5V voltage.

MC33FS6504LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6504LAER2 Applications


There are a lot of NXP USA Inc. MC33FS6504LAER2Power Management applications.

  • Memory Power
  • LP2996A: DDR2
  • Industrial Telemetry Applications
  • Switches
  • GPS
  • Camera Power Applications
  • Networking Equipment
  • Space satellite point of load supply
  • Chromebook
  • Portable Navigation Devices

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