Using Tape & Reel (TR) as a shipping the power management path is acceptable.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.Applications targeting this power management include System Basis Chip and others.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.The power management runs on 1V~5V voltage.
MC33FS6504LAER2 Features
Mainly used in System Basis Chip applications Operating temperature: -40°C~125°C
MC33FS6504LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6504LAER2Power Management applications.