It is acceptable to ship using the method Tape & Reel (TR) .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is targeted at System Basis Chip and other applications.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .1V~5V voltage is used for the operation of this power management.
MC33FS6512CAER2 Features
Mainly used in System Basis Chip applications Operating temperature: -40°C~125°C
MC33FS6512CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6512CAER2Power Management applications.