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MC33FS6512LAE

MC33FS6512LAE

MC33FS6512LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6512LAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8.670340 $8.67034
10 $8.179567 $81.79567
100 $7.716572 $771.6572
500 $7.279785 $3639.8925
1000 $6.867722 $6867.722
MC33FS6512LAE Product Details

MC33FS6512LAE Overview


It is acceptable to ship in the way of Tray .It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For ease of adaptability, Surface Mount is an universal mounting method.This power management targets at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.The power management operates at a voltage of 1V~5V volts.

MC33FS6512LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6512LAE Applications


There are a lot of NXP USA Inc. MC33FS6512LAEPower Management applications.

  • Digital Cores
  • Printers
  • Automotive Navigation Systems
  • Servers
  • Projection Mapping
  • Industrial applications
  • Automotive display
  • Measurement of Point Voltages
  • SSTL-2 Termination
  • Equipment Run-Off of Battery Backup

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