MC33FS6512LAER2 Overview

Tape & Reel (TR) is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at a voltage of 1V~5V volts.

MC33FS6512LAER2 Features

Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6512LAER2 Applications

There are a lot of NXP USA Inc. MC33FS6512LAER2Power Management applications.

• System Thermal for Servers
• Tablets
• HSTL Termination
• Power Factor Correction
• Isolated DC-DC Modules
• Automotive Infotainment
• FPGA
• Peripheral I/O Power
• Set-Top-Box
• Applications Processors