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MC33FS6520LAE

MC33FS6520LAE

MC33FS6520LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6520LAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
250 $6.39600 $1599
MC33FS6520LAE Product Details

MC33FS6520LAE Overview


Tray is acceptable as a shipping the power management method.Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.It targets applications such as System Basis Chip and others.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, the power management uses 1V~5V voltage.

MC33FS6520LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6520LAE Applications


There are a lot of NXP USA Inc. MC33FS6520LAEPower Management applications.

  • DSP
  • Storage Systems
  • Networking Router
  • Equipment Run-Off of Battery Backup
  • Medical
  • Power Supplies
  • Power Factor Correction
  • Cordless Phone Base Station
  • Telecommunication
  • Communications payload

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