Using Tape & Reel (TR) as a shipping the power management path is acceptable.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method facilitates easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS6520LAER2 Features
Mainly used in System Basis Chip applications Operating temperature: -40°C~125°C
MC33FS6520LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6520LAER2Power Management applications.