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MC33FS6522LAER2

MC33FS6522LAER2

MC33FS6522LAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6522LAER2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $9.687000 $9.687
10 $9.138679 $91.38679
100 $8.621396 $862.1396
500 $8.133392 $4066.696
1000 $7.673011 $7673.011
MC33FS6522LAER2 Product Details

MC33FS6522LAER2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is designed for use with applications at System Basis Chip .A temperature setting of -40°C~125°C is recommended to avoid malfunctions.The power management operates at a voltage of 1V~5V volts.

MC33FS6522LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6522LAER2 Applications


There are a lot of NXP USA Inc. MC33FS6522LAER2Power Management applications.

  • In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
  • Automotive display
  • Portable Media Players
  • Networking Router
  • Automotive camera module
  • System Health Monitoring
  • Switches
  • Environmental Test
  • Automotive Navigation Systems
  • Port/cable dongles

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