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MC33FS6523NAE

MC33FS6523NAE

MC33FS6523NAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6523NAE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
250 $7.37100 $1842.75
MC33FS6523NAE Product Details

MC33FS6523NAE Overview


Using Tray as a shipping the power management path is acceptable.Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.As a result, this power management is powered by 1V~5V voltage.

MC33FS6523NAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6523NAE Applications


There are a lot of NXP USA Inc. MC33FS6523NAEPower Management applications.

  • System Thermal for Servers
  • Industrial Equipment
  • Measurement of Point Voltages
  • Cluster
  • DDR2 Termination Voltage
  • Automotive Infotainment
  • System Thermal for PCs
  • Isolated DC-DC Modules
  • Debug
  • SSTL-2 Termination

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