Using Tray as a shipping the power management path is acceptable.Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS6523NAE Features
Mainly used in System Basis Chip applications Operating temperature: -40°C~125°C
MC33FS6523NAE Applications
There are a lot of NXP USA Inc. MC33FS6523NAEPower Management applications.