Tray is acceptable for shipping the power management.To facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method facilitates easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8100CFES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications Operating temperature: -40°C~105°C TA POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100CFES Applications
There are a lot of NXP USA Inc. MC33PF8100CFESPower Management applications.
Telecommunication
System Thermal for Servers
Automotive Navigation Systems
Data Storage
Digital Cores
Server Backplane Systems
Telecom Rectifiers
Power Supplies
Automotive Advanced Driver Assistance System (ADAS)