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MC33PF8100CFES

MC33PF8100CFES

MC33PF8100CFES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8100CFES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $10.052000 $10.052
10 $9.483019 $94.83019
100 $8.946244 $894.6244
500 $8.439853 $4219.9265
1000 $7.962126 $7962.126
MC33PF8100CFES Product Details

MC33PF8100CFES Overview


Tray is acceptable for shipping the power management.To facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method facilitates easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8100CFES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8100CFES Applications


There are a lot of NXP USA Inc. MC33PF8100CFESPower Management applications.

  • Telecommunication
  • System Thermal for Servers
  • Automotive Navigation Systems
  • Data Storage
  • Digital Cores
  • Server Backplane Systems
  • Telecom Rectifiers
  • Power Supplies
  • Automotive Advanced Driver Assistance System (ADAS)
  • Real-time Signal Monitoring

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