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MC33PF8100CGES

MC33PF8100CGES

MC33PF8100CGES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8100CGES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
MC33PF8100CGES Product Details

MC33PF8100CGES Overview


Using Tray as a shipping the power management path is acceptable.packaged the power management in 56-VFQFN Exposed Pad for ease of transportation, it is easy to transport.Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.As a result, this power management is powered by 2.5V~5.5V voltage.

MC33PF8100CGES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8100CGES Applications


There are a lot of NXP USA Inc. MC33PF8100CGESPower Management applications.

  • DSP
  • DDR2 Termination Voltage
  • Power Supplies
  • Printers
  • Set-Top-Box
  • GPS
  • Optical imaging payload
  • Docking station
  • Automotive cluster
  • In Conjunction With the Internal Feedback E/A of OEM Power Supply Units

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