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MC33PF8200CLES

MC33PF8200CLES

MC33PF8200CLES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8200CLES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
MC33PF8200CLES Product Details

MC33PF8200CLES Overview


The way of Tray is acceptable for shipping the power management.A convenient transport package is provided in 56-VFQFN Exposed Pad .For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.The power management is designed for use with applications at High Performance i.MX 8, S32x Processor Based .Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.The power management works at 2.5V~5.5V voltage.

MC33PF8200CLES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8200CLES Applications


There are a lot of NXP USA Inc. MC33PF8200CLESPower Management applications.

  • Networking Equipment
  • Portable Systems
  • Measurement of Point Voltages
  • Docking station
  • Digital Cores
  • Automotive cluster
  • Medical PC
  • Industrial applications
  • SSTL-2 WHITE SPACE
  • SSTL-3 Termination

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