MC33PF8200DAES Overview

The way of Tray is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.This power management uses 2.5V~5.5V voltage for work.

MC33PF8200DAES Features

Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8200DAES Applications

There are a lot of NXP USA Inc. MC33PF8200DAESPower Management applications.

• Camera Power Applications
• Automotive camera module
• Portable Systems
• Applications Processors
• Surround view system ECU
• Automotive cluster
• LTE modem
• Hand-Held Systems
• System Thermal for PCs
• Telecom Rectifiers